Target Components
Sales Line: 01977 739 300
E-mail: sales@targetcomponents.co.uk
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Target Components

 

AFOX 8GB No Heatsink (1 x 8GB) DDR4 2400MHz DIMM System Memory

Key Specifications
Form FactorDIMM
DDR TypeDDR4
Speed2400MHz
Capacity8GB
RGBNo
/productImages/80/SDAFO-AFLD48EH1P.JPG
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Manufacturer : AFOX
EAN : 4897033788176
Manufacturer Part Code : AFLD48EH1P / AFLD48EK1P
Weight : 0.038 kg
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Key Specifications
Form FactorDIMM
DDR TypeDDR4
Speed2400MHz
Capacity8GB
RGBNo
Manufacturer :
AFOX

EAN :
4897033788176

Manufacturer Part Code :
AFLD48EH1P / AFLD48EK1P

Weight :
0.038 kg
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AFOX 8GB No Heatsink (1 x 8GB) DDR4 2400MHz DIMM System Memory

Memory Size
8GB

Memory Type
DDR4

Module Type
288 Pin Unbuffered DIMM Non ECC

Pin Configuration
288-pin

Error Correction
-

CL-tRCD-tRP-tRAS
CAS latency : CL17

DRAM Density
512x8

Data transfer bandwidth
17000MB/s

Heat Sink
No

Working voltage
1.2V
Manufacturer's Website:
Warranty:
Lifetime Return to Base Warranty
CERTIFICATES
Certification CE
DESIGN
Certification CE
Colour of product Black
RoHS compliance Y
JEDEC standard Y
ENERGY MANAGEMENT
Memory voltage 1.2 V
FEATURES
Certification CE
Internal memory type DDR4
ECC N
CAS latency 17
Colour of product Black
Memory clock speed 2400 MHz
Row cycle time 46.5 ns
Refresh row cycle time 260 ns
Row active time 33 ns
Memory voltage 1.2 V
RoHS compliance Y
Memory form factor 288-pin DIMM
Memory channels dual
Component for PC/server
Internal memory 8 GB
Memory layout (modules x size) 1 x 8 GB
JEDEC standard Y
Programming power voltage (VPP) 2.5 V
Buffered memory type Unregistered (unbuffered)
MEMORY
Internal memory type DDR4
ECC N
CAS latency 17
Memory clock speed 2400 MHz
Row cycle time 46.5 ns
Refresh row cycle time 260 ns
Row active time 33 ns
Memory bandwidth (max) 19.2 GB/s
Memory voltage 1.2 V
Memory form factor 288-pin DIMM
Memory channels support dual
Compatible chipsets Intel® H110
Component for PC/server
Internal memory 8 GB
Memory layout (modules x size) 1 x 8 GB
Programming power voltage (VPP) 2.5 V
Buffered memory type Unregistered (unbuffered)
OPERATIONAL CONDITIONS
Storage temperature range (T-T) -55 - 100 °C
Operating temperature range (T-T) 0 - 85 °C
OTHER FEATURES
Country of origin China
Chips organisation x8 FBGA DRAM
PACKAGING DATA
Package weight 36 g
Package height 88 mm
Package width 168 mm
TECHNICAL DETAILS
Country of origin China
Chips organisation x8 FBGA DRAM
WEIGHT & DIMENSIONS
Weight 18 g
Package weight 36 g
Height 31 mm
Width 133 mm
Package height 88 mm
Package width 168 mm

 
Contact Information

Target Components Ltd
Unit 5
Pioneer Way
Pioneer Ind Est
Castleford
WF10 5QU

Tel:01977 739 300
email: sales@targetcomponents.co.uk

 
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