ENERGY MANAGEMENT
|
Thermal Design Power (TDP) |
65 W |
FEATURES
|
Supported instruction sets |
SSE4.1,SSE4.2,AVX 2.0 |
PCI Express slots version |
3.0 |
Execute Disable Bit |
Y |
Idle States |
Y |
Thermal Monitoring Technologies |
Y |
Scalability |
1S |
CPU configuration (max) |
1 |
Embedded options available |
N |
PCI Express configurations |
1x16,2x8,1x8+2x4 |
Thermal Design Power (TDP) |
65 W |
Thermal solution specification |
PCG 2015C |
Device ID |
0x3E91 |
Maximum number of PCI Express lanes |
16 |
Market segment |
Desktop |
Processor package size |
37.5 x 37.5 mm |
Harmonized System (HS) code |
8542310001 |
Processor ARK ID |
134870 |
Export Control Classification Number (ECCN) |
5A992C |
Commodity Classification Automated Tracking System (CCATS) |
G077159 |
PCI Express CEM revision |
3.0 |
GRAPHICS
|
On-board graphics adapter model |
Intel® UHD Graphics 630 |
Discrete graphics adapter model |
Not available |
On-board graphics adapter |
Y |
Graphics base frequency |
350 MHz |
Graphics max dynamic frequency |
1100 MHz |
Maximum resolution (DisplayPort) |
4096 x 2304 pixels |
On-board graphics adapter ID |
0x3E91 |
On-board graphics adapter 4K support |
Y |
On-board graphics adapter maximum resolution (eDP - Integrated Flat Panel) |
4096 x 2304 pixels |
On-board graphics adapter refresh rate at maximum resolution (eDP - Integrated Flat Panel) |
60 Hz |
On-board graphics adapter refresh rate at maximum resolution (DisplayPort) |
60 Hz |
On-board graphics adapter refresh rate at maximum resolution (HDMI) |
24 Hz |
Maximum graphics adapter memory |
64 GB |
On-board graphics adapter memory |
64 GB |
Maximum on-board graphics adapter memory |
64 GB |
Number of displays supported by on-board graphics adapter |
3 |
On-board graphics adapter maximum resolution (HDMI) |
4096 x 2304 pixels |
On-board graphics adapter DirectX version |
12.0 |
On-board graphics adapter OpenGL version |
4.5 |
Discrete graphics adapter |
N |
MEMORY
|
ECC |
Y |
Supported memory types |
DDR4-SDRAM |
Memory channels support |
Dual-channel |
Maximum internal memory supported by processor |
64 GB |
Memory types supported by processor |
DDR4-SDRAM |
Memory clock speeds supported by processor |
2400 MHz |
Memory bandwidth supported by processor (max) |
37.5 GB/s |
OPERATIONAL CONDITIONS
|
Tjunction |
100 °C |
OTHER FEATURES
|
Maximum internal memory |
64 GB |
CPU configuration (max) |
1 |
PACKAGING DATA
|
Package weight |
338 g |
Package depth |
116 mm |
Package height |
101 mm |
Package width |
70 mm |
Package type |
Retail box |
PROCESSOR
|
Processor model |
i3-9100 |
Processor manufacturer |
Intel |
Processor process |
14 nm |
Processor family |
9th gen Intel® Core™ i3 |
Box |
Y |
Processor socket |
LGA 1151 (Socket H4) |
Processor number of cores |
4 |
System bus |
8 GT/s |
Processor number of threads |
4 |
Processor operating modes |
64-bit |
Turbo frequency (max) |
4.2 GHz |
Component for |
PC |
Processor cache |
6 MB |
Processor clock speed |
3.6 GHz |
Thermal Design Power (TDP) |
65 W |
Processor codename |
Coffee Lake |
Processor cache type |
Smart Cache |
Memory bandwidth supported by processor (max) |
37.5 GB/s |
Processor ARK ID |
134870 |
Cooler included |
Y |
Generation |
9th Generation |
Processor base frequency |
3.6 GHz |
PROCESSOR SPECIAL FEATURES
|
Intel Identity Protection Technology |
Y |
Intel vPro Technology |
N |
Intel Hyper-Threading Technology |
N |
Intel Turbo Boost Technology |
2.0 |
Intel Quick Sync Video Technology |
Y |
Intel InTru 3D Technology |
Y |
Intel Clear Video HD Technology |
Y |
Intel AES New Instructions |
Y |
Enhanced Intel SpeedStep Technology |
Y |
Intel Trusted Execution Technology |
N |
Intel VT-x with Extended Page Tables (EPT) |
Y |
Intel TSX-NI |
N |
Intel Secure Key |
Y |
Intel 64 |
Y |
Intel Stable Image Platform Program (SIPP) |
N |
OS Guard |
Y |
Intel Virtualization Technology for Directed I/O (VT-d) |
Y |
Intel Clear Video Technology |
Y |
Intel Software Guard Extensions (Intel SGX) |
Y |
Intel Virtualization Technology (VT-x) |
Y |
Intel® Optane? Memory Ready |
Y |
Intel® Memory Protection Extensions (Intel® MPX) |
Y |
Intel® Boot Guard |
Y |
Intel® vPro? Platform Eligibility |
N |
Intel® Transactional Synchronization Extensions |
N |
Intel® Turbo Boost Technology 2.0 frequency |
4.2 GHz |
TECHNICAL DETAILS
|
Supported instruction sets |
SSE4.1,SSE4.2,AVX 2.0 |
Supported memory types |
DDR4-SDRAM |
PCI Express slots version |
3.0 |
Intel Identity Protection Technology |
Y |
Intel vPro Technology |
N |
Intel Hyper-Threading Technology |
N |
Intel Turbo Boost Technology |
2.0 |
Intel Quick Sync Video Technology |
Y |
Intel InTru 3D Technology |
Y |
Intel Clear Video HD Technology |
Y |
Intel AES New Instructions |
Y |
Enhanced Intel SpeedStep Technology |
Y |
Execute Disable Bit |
Y |
Idle States |
Y |
Thermal Monitoring Technologies |
Y |
Intel Trusted Execution Technology |
N |
Scalability |
1S |
CPU configuration (max) |
1 |
Intel VT-x with Extended Page Tables (EPT) |
Y |
Embedded options available |
N |
PCI Express configurations |
1x16,2x8,1x8+2x4 |
Thermal Design Power (TDP) |
65 W |
Product type |
Processor |
Intel TSX-NI |
N |
Intel Secure Key |
Y |
Thermal solution specification |
PCG 2015C |
Intel 64 |
Y |
Intel Stable Image Platform Program (SIPP) |
N |
Intel Virtualization Technology for Directed I/O (VT-d) |
Y |
Cache type |
Smart Cache |
Status |
Launched |
Maximum resolution & refresh rate (DisplayPort) |
4096 x 2304@60Hz |
Launch date |
Q2''19 |
Intel Virtualization Technology (VT-x) |
Y |
Maximum graphics adapter memory |
64 GB |
Market segment |
Desktop |
Maximum memory |
64 GB |
Processor ID |
0x3E91 |
Bus speed |
8 GT/s |
WEIGHT & DIMENSIONS
|
Package weight |
338 g |
Packaging depth |
116 mm |
Package height |
101 mm |
Packaging width |
70 mm |
Processor package size |
37.5 x 37.5 mm |