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Intel i7 10700KF Comet Lake Eight Core 3.8GHz 1200 Socket Processor

Key Specifications
Socket1200
On-Chip GraphicsNo
Speed3.8GHz
Core Quantity8
Manufacturer : INTEL
EAN : 5032037188685
Manufacturer Part Code : BX8070110700KF
Weight : 0.05 kg
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Key Specifications
Socket1200
On-Chip GraphicsNo
Speed3.8GHz
Core Quantity8
Manufacturer :
INTEL

EAN :
5032037188685

Manufacturer Part Code :
BX8070110700KF

Weight :
0.05 kg
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Intel® Optane™ Memory Supported

Intel® Optane™ memory is a revolutionary new class of non-volatile memory that sits in between system memory and storage to accelerate system performance and responsiveness. When combined with the Intel® Rapid Storage Technology Driver, it seamlessly manages multiple tiers of storage while presenting one virtual drive to the OS, ensuring that data frequently used resides on the fastest tier of storage. Intel® Optane™ memory requires specific hardware and software configuration.

Intel® Turbo Boost Technology

Intel® Turbo Boost Technology dynamically increases the processor's frequency as needed by taking advantage of thermal and power headroom to give you a burst of speed when you need it, and increased energy efficiency when you don't.

Intel® Hyper-Threading Technology

Intel® Hyper-Threading Technology (Intel® HT Technology) delivers two processing threads per physical core. Highly threaded applications can get more work done in parallel, completing tasks sooner.

Intel® Virtualization Technology (VT-x)

Intel® Virtualization Technology (VT-x) allows one hardware platform to function as multiple ?virtual? platforms. It offers improved manageability by limiting downtime and maintaining productivity by isolating computing activities into separate partitions.

Intel® Virtualization Technology for Directed I/O (VT-d)

Intel® Virtualization Technology for Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and Itanium® processor (VT-i) virtualization adding new support for I/O-device virtualization. Intel VT-d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments.

Intel® VT-x with Extended Page Tables (EPT)

Intel® VT-x with Extended Page Tables (EPT), also known as Second Level Address Translation (SLAT), provides acceleration for memory intensive virtualized applications. Extended Page Tables in Intel® Virtualization Technology platforms reduces the memory and power overhead costs and increases battery life through hardware optimization of page table management.

Intel® 64

Intel® 64 architecture delivers 64-bit computing on server, workstation, desktop and mobile platforms when combined with supporting software.¹ Intel 64 architecture improves performance by allowing systems to address more than 4 GB of both virtual and physical memory.

Instruction Set

An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. The value shown represents which Intel's instruction set this processor is compatible with.

Instruction Set Extensions

Instruction Set Extensions are additional instructions which can increase performance when the same operations are performed on multiple data objects. These can include SSE (Streaming SIMD Extensions) and AVX (Advanced Vector Extensions).

Idle States

Idle States (C-states) are used to save power when the processor is idle. C0 is the operational state, meaning that the CPU is doing useful work. C1 is the first idle state, C2 the second, and so on, where more power saving actions are taken for numerically higher C-states.

Enhanced Intel SpeedStep® Technology

Enhanced Intel SpeedStep® Technology is an advanced means of enabling high performance while meeting the power-conservation needs of mobile systems. Conventional Intel SpeedStep® Technology switches both voltage and frequency in tandem between high and low levels in response to processor load. Enhanced Intel SpeedStep® Technology builds upon that architecture using design strategies such as Separation between Voltage and Frequency Changes, and Clock Partitioning and Recovery.

Thermal Monitoring Technologies

Thermal Monitoring Technologies protect the processor package and the system from thermal failure through several thermal management features. An on-die Digital Thermal Sensor (DTS) detects the core's temperature, and the thermal management features reduce package power consumption and thereby temperature when required in order to remain within normal operating limits.

Intel® Identity Protection Technology

Intel® Identity Protection Technology is a built-in security token technology that helps provide a simple, tamper-resistant method for protecting access to your online customer and business data from threats and fraud. Intel® IPT provides a hardware-based proof of a unique user's PC to websites, financial institutions, and network services; providing verification that it is not malware attempting to login. Intel® IPT can be a key component in two-factor authentication solutions to protect your information at websites and business log-ins.

Chip Name
BX8070110700KF Comet Lake

Socket
LGA1200

CPU Size
14nm

Number of Cores
8

Number of Threads
16

Base Clock Speed (up to)
3.8GHz

Turbo Boost Technology 2.0 (up to)
5.00GHz

Turbo Boost Technology 3.0 (up to)
5.10GHz

Thermal Velocity (up to)
N/A

Unlocked Core Multiplier
Y

Processor Graphics
N/A

GPU Base Speed
350 MHz

GPU Max Speed
1.20 GHz
Manufacturer's Website:
Warranty:
3 Years Manufacturers Warranty, Tel: 0870 607 2439
ENERGY MANAGEMENT
Thermal Design Power (TDP) 125 W
Configurable TDP-down 95 W
Configurable TDP-down frequency 3500 MHz
FEATURES
Supported instruction sets SSE4.1,SSE4.2,AVX 2.0
PCI Express slots version 3.0
Execute Disable Bit Y
Idle States Y
Thermal Monitoring Technologies Y
Scalability 1S
CPU configuration (max) 1
Embedded options available N
PCI Express configurations 1x16,2x8,1x8+2x4
Thermal Design Power (TDP) 125 W
Thermal solution specification PCG 2015D
Maximum number of PCI Express lanes 16
Processor package size 37.5 x 37.5 mm
Harmonized System (HS) code 8542310001
Processor ARK ID 199325
PCI Express CEM revision 3.0
GRAPHICS
On-board graphics adapter model Not available
Discrete graphics adapter model Not available
On-board graphics adapter N
Discrete graphics adapter N
MEMORY
ECC N
Memory channels support Dual-channel
Maximum internal memory supported by processor 128 GB
Memory types supported by processor DDR4-SDRAM
Memory clock speeds supported by processor 2933 MHz
Memory bandwidth supported by processor (max) 45.8 GB/s
OPERATIONAL CONDITIONS
Tjunction 100 °C
OTHER FEATURES
CPU configuration (max) 1
PROCESSOR
Processor model i7-10700KF
Processor manufacturer Intel
Processor process 14 nm
Processor family 10th gen Intel® Core™ i7
Box Y
Processor socket LGA 1200 (Socket H5)
Processor number of cores 8
System bus 8 GT/s
Processor number of threads 16
Processor operating modes 64-bit
Turbo frequency (max) 5.1 GHz
Component for PC
Processor cache 16 MB
Processor clock speed 3.8 GHz
Thermal Design Power (TDP) 125 W
Processor codename Comet Lake
Configurable TDP-down 95 W
Processor cache type Smart Cache
Configurable TDP-down frequency 3500 MHz
Memory bandwidth supported by processor (max) 45.8 GB/s
Processor ARK ID 199325
Generation 10th Generation
PROCESSOR SPECIAL FEATURES
Intel Identity Protection Technology Y
Intel Hyper-Threading Technology Y
Intel Turbo Boost Technology 2.0
Intel AES New Instructions Y
Enhanced Intel SpeedStep Technology Y
Intel Trusted Execution Technology N
Intel VT-x with Extended Page Tables (EPT) Y
Intel Secure Key Y
Intel 64 Y
Intel Stable Image Platform Program (SIPP) N
OS Guard Y
Intel Virtualization Technology for Directed I/O (VT-d) Y
Intel Software Guard Extensions (Intel SGX) Y
Intel Virtualization Technology (VT-x) Y
Intel Turbo Boost Max Technology 3.0 Y
Intel® Optane? Memory Ready Y
Intel® Boot Guard Y
Intel® Thermal Velocity Boost N
Intel® vPro? Platform Eligibility N
TECHNICAL DETAILS
Supported instruction sets SSE4.1,SSE4.2,AVX 2.0
PCI Express slots version 3.0
Intel Identity Protection Technology Y
Intel Hyper-Threading Technology Y
Intel Turbo Boost Technology 2.0
Intel AES New Instructions Y
Enhanced Intel SpeedStep Technology Y
Execute Disable Bit Y
Idle States Y
Thermal Monitoring Technologies Y
Intel Trusted Execution Technology N
Scalability 1S
CPU configuration (max) 1
Intel VT-x with Extended Page Tables (EPT) Y
Embedded options available N
PCI Express configurations 1x16,2x8,1x8+2x4
Thermal Design Power (TDP) 125 W
Product type Processor
Intel Secure Key Y
Thermal solution specification PCG 2015D
Intel 64 Y
Intel Stable Image Platform Program (SIPP) N
Intel Virtualization Technology for Directed I/O (VT-d) Y
Cache type Smart Cache
Status Launched
Launch date Q2'20
Intel Virtualization Technology (VT-x) Y
Maximum memory 128 GB
Bus speed 8 GT/s
WEIGHT & DIMENSIONS
Processor package size 37.5 x 37.5 mm

 
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Target Components Ltd
Unit 5
Pioneer Way
Pioneer Ind Est
Castleford
WF10 5QU

Tel:01977 739 300
email: sales@targetcomponents.co.uk

 
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