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Target Components


Intel Core i9 11900 2.5GHz 8 Core LGA 1200 Rocket Lake Processor, 16 Threads, 5.2GHz Boost

Key Specifications
On-Chip GraphicsYes
Core Quantity8
PrefixCore i9
Manufacturer : INTEL
EAN : 5032037214988
Manufacturer Part Code : BX8070811900
Weight : 0.05 kg
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Key Specifications
On-Chip GraphicsYes
Core Quantity8
PrefixCore i9
Manufacturer :


Manufacturer Part Code :

Weight :
0.05 kg
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Intel® Turbo Boost Technology

Intel® Turbo Boost Technology dynamically increases the processor's frequency as needed by taking advantage of thermal and power headroom to give you a burst of speed when you need it, and increased energy efficiency when you don't.

Intel® vPro™ Platform Eligibility

Intel® vPro™ Technology is a set of security and manageability capabilities built into the processor aimed at addressing four critical areas of IT security: 1) Threat management, including protection from rootkits, viruses, and malware 2) Identity and web site access point protection 3) Confidential personal and business data protection 4) Remote and local monitoring, remediation, and repair of PCs and workstations.

Intel® Hyper-Threading Technology

Intel® Hyper-Threading Technology (Intel® HT Technology) delivers two processing threads per physical core. Highly threaded applications can get more work done in parallel, completing tasks sooner.

Intel® Virtualization Technology (VT-x)

Intel® Virtualization Technology (VT-x) allows one hardware platform to function as multiple ?virtual? platforms. It offers improved manageability by limiting downtime and maintaining productivity by isolating computing activities into separate partitions.

Intel® Virtualization Technology for Directed I/O (VT-d)

Intel® Virtualization Technology for Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and Itanium® processor (VT-i) virtualization adding new support for I/O-device virtualization. Intel VT-d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments.

Intel® VT-x with Extended Page Tables (EPT)

Intel® VT-x with Extended Page Tables (EPT), also known as Second Level Address Translation (SLAT), provides acceleration for memory intensive virtualized applications. Extended Page Tables in Intel® Virtualization Technology platforms reduces the memory and power overhead costs and increases battery life through hardware optimization of page table management.

Intel® 64

Intel® 64 architecture delivers 64-bit computing on server, workstation, desktop and mobile platforms when combined with supporting software.¹ Intel 64 architecture improves performance by allowing systems to address more than 4 GB of both virtual and physical memory.

Instruction Set

An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. The value shown represents which Intel's instruction set this processor is compatible with.

Instruction Set Extensions

Instruction Set Extensions are additional instructions which can increase performance when the same operations are performed on multiple data objects. These can include SSE (Streaming SIMD Extensions) and AVX (Advanced Vector Extensions).

Idle States

Idle States (C-states) are used to save power when the processor is idle. C0 is the operational state, meaning that the CPU is doing useful work. C1 is the first idle state, C2 the second, and so on, where more power saving actions are taken for numerically higher C-states.

Enhanced Intel SpeedStep® Technology

Enhanced Intel SpeedStep® Technology is an advanced means of enabling high performance while meeting the power-conservation needs of mobile systems. Conventional Intel SpeedStep® Technology switches both voltage and frequency in tandem between high and low levels in response to processor load. Enhanced Intel SpeedStep® Technology builds upon that architecture using design strategies such as Separation between Voltage and Frequency Changes, and Clock Partitioning and Recovery.

Thermal Monitoring Technologies

Thermal Monitoring Technologies protect the processor package and the system from thermal failure through several thermal management features. An on-die Digital Thermal Sensor (DTS) detects the core's temperature, and the thermal management features reduce package power consumption and thereby temperature when required in order to remain within normal operating limits.

Intel® Identity Protection Technology

Intel® Identity Protection Technology is a built-in security token technology that helps provide a simple, tamper-resistant method for protecting access to your online customer and business data from threats and fraud. Intel® IPT provides a hardware-based proof of a unique user's PC to websites, financial institutions, and network services; providing verification that it is not malware attempting to login. Intel® IPT can be a key component in two-factor authentication solutions to protect your information at websites and business log-ins.

Intel® Stable Image Platform Program (SIPP)

Intel® Stable Image Platform Program (Intel® SIPP) can help your company identify and deploy standardized, stable image PC platforms for at least 15 months.

Intel® Deep Learning Boost (Intel® DL Boost)

A new set of embedded processor technologies designed to accelerate AI deep learning use cases. It extends Intel AVX-512 with a new Vector Neural Network Instruction (VNNI) that significantly increases deep learning inference performance over previous generations.

Intel® Thermal Velocity Boost

Intel® Thermal Velocity Boost (Intel® TVB) is a feature that opportunistically and automatically increases clock frequency above single-core and multi-core Intel® Turbo Boost Technology frequencies based on how much the processor is operating below its maximum temperature and whether turbo power budget is available. The frequency gain and duration is dependent on the workload, capabilities of the processor and the processor cooling solution.

Chip Name
BX8070811900 Rocket Lake


CPU Size

Number of Cores

Number of Threads

Base Clock Speed (up to)

Turbo Boost Technology 2.0 (up to)

Turbo Boost Technology 3.0 (up to)

Thermal Velocity (up to)

Unlocked Core Multiplier

Processor Graphics
Intel UHD Graphics 750

GPU Base Speed
350 MHz

GPU Max Speed

16MB Intel Smart Cache



Manufacturer's Website:
3 Years Manufacturers Warranty, Tel: 0870 607 2439
Supported instruction sets SSE4.1, SSE4.2, AVX 2.0, AVX-512
PCI Express slots version 4.0
Execute Disable Bit Yes
Idle States Yes
Thermal Monitoring Technologies Yes
Scalability 1S
CPU configuration (max) 1
Embedded options available No
PCI Express configurations 1x16+1x4, 2x8+1x4, 1x8+3x4
Maximum number of PCI Express lanes 20
Market segment Desktop
Harmonized System (HS) code 85423119
Export Control Classification Number (ECCN) 5A992CN3
Commodity Classification Automated Tracking System (CCATS) G167599
Use conditions PC/Client/Tablet
On-board graphics card model Intel UHD Graphics 750
Discrete graphics card model Not available
On-board graphics card Yes
On-board graphics card base frequency 350 MHz
On-board graphics card dynamic frequency (max) 1300 MHz
On-board graphics card maximum resolution (DisplayPort) 5120 x 3200 pixels
Number of execution units 32
On-board graphics card ID 0x4C8A
On-board graphics card 4K support Yes
On-board graphics card maximum resolution (eDP - Integrated Flat Panel) 5120 x 3200 pixels
On-board graphics card refresh rate at maximum resolution (eDP - Integrated Flat Panel) 60 Hz
On-board graphics card refresh rate at maximum resolution (DisplayPort) 60 Hz
On-board graphics card refresh rate at maximum resolution (HDMI) 60 Hz
Maximum on-board graphics card memory 64 GB
Number of displays supported (on-board graphics) 3
On-board graphics card maximum resolution (HDMI) 4096 x 2160 pixels
On-board graphics card OpenGL version 4.5
Discrete graphics card No
Country of origin Malaysia
Harmonized System (HS) code 85423119
Memory bandwidth (max) 50 GB/s
Memory channels Dual-channel
Maximum internal memory supported by processor 128 GB
Memory types supported by processor DDR4-SDRAM
Memory clock speeds supported by processor 3200 MHz
Tjunction 100 °C
Maximum internal memory 128 GB
Package weight 0.298 g
Package weight 298 g
Package type Retail box
Processor model i9-11900
Processor manufacturer Intel
Processor lithography 14 nm
Processor family Intel® Core™ i9
Box Yes
Processor socket LGA 1200 (Socket H5)
Processor cores 8
System bus rate 8 GT/s
Processor threads 16
Processor operating modes 64-bit
Processor boost frequency 5.2 GHz
Component for PC
Processor cache 16 MB
Thermal Design Power (TDP) 65 W
Processor cache type Smart Cache
Memory bandwidth supported by processor (max) 50 GB/s
Processor ARK ID 212252
Processor base frequency 2.5 GHz
Processor generation 11th gen Intel® Core™ i9
Intel® Identity Protection Technology (Intel® IPT) Yes
Intel® Hyper Threading Technology (Intel® HT Technology) Yes
Intel® Turbo Boost Technology 2.0
Intel® Quick Sync Video Technology Yes
Intel® InTru? 3D Technology Yes
Intel® Clear Video HD Technology (Intel® CVT HD) Yes
Intel® AES New Instructions (Intel® AES-NI) Yes
Enhanced Intel SpeedStep Technology Yes
Intel Trusted Execution Technology Yes
Intel VT-x with Extended Page Tables (EPT) Yes
Intel® Secure Key Yes
Intel 64 Yes
Intel Stable Image Platform Program (SIPP) Yes
Intel® OS Guard Yes
Intel Virtualization Technology for Directed I/O (VT-d) Yes
Intel Clear Video Technology Yes
Intel Software Guard Extensions (Intel SGX) No
Intel Virtualization Technology (VT-x) Yes
Intel Turbo Boost Max Technology 3.0 Yes
Intel® Optane? Memory Ready Yes
Intel® Boot Guard Yes
Intel® Thermal Velocity Boost Yes
Intel® vPro? Platform Eligibility Yes
Intel® Deep Learning Boost (Intel® DL Boost) Yes
Intel® Thermal Velocity Boost Frequency 5.2 GHz
Intel® Thermal Velocity Boost Temperature 70 °C
Intel® Turbo Boost Max Technology 3.0 frequency 5.1 GHz
Intel® Turbo Boost Technology 2.0 frequency 5 GHz
Intel® Gaussian & Neural Accelerator (Intel® GNA) 2.0 Yes
Supported memory types DDR4-SDRAM
Status Launched
Launch date Q1''21
Target market Gaming, Content Creation
Weight 0.025 g
Weight 25 g
Height 101 mm
Width 70 mm
Depth 116 mm
Processor package size 37.5 x 37.5 mm

Contact Information

Target Components Ltd
Unit 5
Pioneer Way
Pioneer Ind Est
WF10 5QU

Tel:01977 739 300

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